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Spatial Atomic Layer Deposition System

Enables fast, solvent-free coating of nanoscale thin films that don’t affect the compostability or recyclability of sustainable packaging

Background

Atomic layer deposition (ALD) is the best technique for producing films with nanometre-scale thickness control, as it deposits a film one atomic layer at a time. As feature sizes continue to decrease in applications such as integrated circuits and memory devices, ALD is becoming the only option for depositing some thin-film components which are not possible using CVD and PVD processes.

Conventional ALD operates by sequentially inserting two chemical precursor gases into a vacuum chamber, with evacuation and purge steps in between the exposures. A single atomic layer of the material is formed after each sequence, and the sequence is repeated multiple times to build up a film. Hence conventional ALD separates the two precursor gases in time. In

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